AIM:
To
study the different inter connection
methods using electronic circuits.
COMPONENTS AND EQUIPMENTS REQUIRED
Bread
board, connectors, crimping tool, soldering iron, PCB, solder flux
THEORY
a)Breadboard
A breadboard is a construction base for prototyping of electronics. It is a rectangular plastic board with a bunch of tiny holes in it. These holes let you easily insert electronic components to prototype (meaning to build and test an early version of) an electronic circuit.Because the solder less breadboard does not require soldering,
it is reusable. This makes it easy to use for creating temporary prototypes and
experimenting with circuit design. For this reason, solder less breadboards are
also extremely popular with students and in technological education.
b) CRIMP CONNECTION
A crimp
connection is achieved with a
type of solderless electrical
connector. Simple crimp connectors are typically used to terminate stranded wire. Specialised crimp
connectors are also used, for example as signal
connectors on coaxial cables in applications at high radio
frequencies (VHF, UHF).
c) SOLDERING
Soldering is a skill that requires both knowledge and
practice. Soldering is a method of joining metal parts using a filler metal of
low melting point (solder). Purpose of
soldering is (i) Good Electrical
Connections ii) Strong Mechanical Connections. Soldering Iron is used to melt
the solder and to make the joint of the metal parts. The reverse process of
soldering is called de-soldering.
i)SOLDERING IRON
To
make good connection you have to heat the junction somewhat above the melting
temperature of solder this is the job of the soldering iron. • Soldering iron
comes in different sizes. • It is rated in terms of wattage (5W to 100W). •
Thicker connection such as connectors requires more heat from soldering iron so
we need higher wattage soldering iron. • Lighter connections like IC pins
requires less heat so requires only less wattage irons.
SOLDER
Solder is a metal or metallic alloy used, when melted,Ø to join metallic surfaces together. The most common
alloy is some combination of tin and lead.
Certain special applications may require SilverØ
Solder. Solder can be selected
considering followingØ Low melting temperatureØ Narrow or No
soft regionØ 60/40 is the most common for electronic
soldering.Ø Solder wire available in different diameters,
largerØ diameter required
for soldering connectors, small diameters is sufficient for PCB soldering.
DESOLDERING
TECHNIQUES
Desoldering
is done to remove the solder from a joint, because of replacement for a faulty
component or for fixing a dry joint.
DESOLDERING
PUMP
The
usual way is to use a desoldering pump which works like a small spring-loadedØ pump, only in reverse (More demanding users using
CMOS devices might need a pump which is ESD safe.) A spring-loaded plunger is released at the
push of a button and the molten solder is thenØ drawn
up into the pump. It may take one or two attempts to clean up a joint this way,
but a small desoldering pump is an invaluable tool especially for PCB work.
DESOLDERING
WICK
An
excellent alternative to a pump is to use desoldering wick which are packaged
inØ small dispenser
reels. This product is a specially
treated fine copper braid which draws molten solder up intoØ the braid where it solidifies. The best way is to use the tip of the hot
iron to press a short length of braid down ontoØ the
joint to be de-soldered. The iron will
subsequently melt the solder, which will be drawn up into the braid. TakeØ extreme care to ensure that you don't allow the
solder to cool with the braid adhering to the work, or you run the risk of damaging
PCB copper tracks when you attempt to pull the braid off the joint.
RESULT
Studied the various interconnection methods.
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